Bond and Sukuk

In 2012, the Company made a public offering of a bond programme (Public Offering of SMART Shelf-Registered Bond I) amounting to Rp 3 trillion. With regards to this programme, on 4 July 2012, the Company issued SMART Shelf-Registered Bond I Phase I Year 2012 with a principal amount of Rp 1 trillion. These bonds have been fully settled on the due dates.

In March 2020, the Company made another public offering of a bond programme (Public Offering of SMART Shelf-Registered Bond II Year 2020) amounting to Rp 3 trillion. With regards to this programme, the Company issued the bonds in three phases, i.e. Phase I Year 2020 with a principal amount of Rp 775 billion on 3 April 2020, Phase II Year 2020 with a principal amount of Rp 1.4 trillion on 22 October 2020, and Phase III Year 2021 with a principal amount of Rp 825 billion on 19 February 2021. These bonds have been fully settled on the due dates.

In June 2021, the Company made a public offering of SMART Shelf-Registered Bond III with total principal amount of Rp 5 trillion. With regards to this programme, the Company has issued the bonds in three phases.

In June 2022, the Company made a public offering of SMART Shelf-Registered Bond IV with total principal amount of Rp 6 trillion. With regards to this programme, on 6 July 2022, the Company has issued SMART Shelf-Registered Bond IV Phase I Year 2022 with a principal amount of Rp 1.5 trillion. Below are series of the bonds issued:

• Series A: nominal value of Rp 560 billion, 4.75% interest rate, 370 day tenor, due on 16 July 2023;
• Series B: nominal value of Rp 538 billion, 7.00% interest rate, 3 year tenor, due on 6 July 2025; and
• Series C: nominal value of Rp 402 billion, 8.00% interest rate, 5 year tenor, due on 6 July 2027.

In July 2025, the Company made a public offering of SMART Shelf-Registered Bond V with total principal amount of Rp 5 trillion. With regards to this programme, the Company has issued the bonds in two phases.

1. On 2 July 2025, the Company has issued SMART Shelf-Registered Bond V Phase I Year 2025 with a principal amount of Rp 500 billion, fixed interest rate of 7.50% per year, and 5 year tenor which will be due on 2 July 2030.
2. On 6 February 2026, the Company has issued SMART Shelf-Registered Bond V Phase II Year 2026 with a principal amount of Rp 672 billion. Below are series of the bonds issued:

• Series A: nominal value of Rp 385 billion, 6.20% interest rate, 5 year tenor, due on 4 February 2031; and
• Series B: nominal value of Rp 287 billion, 6.50% interest rate, 7 year tenor, due on 4 February 2033.

In July 2025, the Company also made a public offering of SMART Shelf-Registered Sukuk Ijarah I with total principal amount of Rp 2.5 trillion. With regards to this programme, the Company has issued the Sukuk Ijarah in two phases.

1. On 2 July 2025, the Company has issued SMART Shelf-Registered Sukuk Ijarah I Phase I Year 2025 with outstanding ijarah return amount of Rp 500 billion, with annual ijarah return of Rp 37.5 billion per year. The tenor of Sukuk Ijarah is 5 years and will be due on 2 July 2030.
2. On 4 February 2026, the Company has issued SMART Shelf-Registered Sukuk Ijarah I Phase II Year 2026 with outstanding ijarah return amount of Rp 528 billion. Below are series of the Sukuk Ijarah issued:

• Series A: outstanding ijarah return amount of Rp 460 billion, annual ijarah return of Rp 28.52 billion, 5 year tenor, due on 4 February 2031; and
• Series B: outstanding ijarah return amount of Rp 68 billion, annual ijarah return of Rp 4.42 billion, 7 year tenor, due on 4 February 2033.

The proceeds obtained from the above-mentioned bond and sukuk ijarah issuances will be used to settle the principal of long-term bank loans and bonds payable upon maturity as well as to finance the working capital of the Company’s business activities.